NEXUS Thermal Compound

0 cm "> Special teplovodivá pasta suitable for all of today's high-performance processors and heatsinks.It is designed for maximum transmission of temperature between the core processor or a graphics card cooler.It is made with more than 30% content of silver and other materials and is designed for long-term operation with constant thermal conductivity.
The high thermal conductivity ensures immediate transfer of waste heat from the chip to the heatsink and thus increases the lifetime of components.Pasta in the correct application complete all the pores and the surface roughness and the chip temperature to the processor because of its efficiency decreases as well as several degrees.Not only because of the absence of silicon is also negligible electrical conductivity.Weight supplied paste is 10 grams.Quantity is sufficient to use least ten.Applied to the application of small quantities on the surface of the chip or the CPU heatspreader and grind into a thin film such as card or razor blade.For greater efficiency of cooling, we recommend that pastu combined with better cooler.
Parameters and specifications:
Suitable for:normal "> Any type of processor and graphics cards

Operating temperature:
-50 ° C to 170 ° C

Number of application:normal "> 10

Weight:normal "> 1 g